Form available @ HERE
Form available @ HERE
For more info, please visit http://www.mrepc.com/scholarships/
In furtherance to Toray’s corporate philosophy of “Contributing to society through the creation of new value with innovative ideas, technologies and products”, TORAY Group (Malaysia) of Companies has embarked on yet another education/HR initiative to enhance human capital development, via a Scholarship program called “TORAY Scholarship Program”.
Knowing “TORAY Scholarship Program” via “5 Ws & IH”.
TORAY Scholarship Program serves two purposes:
TORAY Scholarship Program is a Scholarship program initiated by TORAY Group (Malaysia) of Companies to assist eligible Malaysian undergraduates to pursue full-time bachelor degree courses at the selected local university(ies). The graduates will be offered suitable jobs upon completion of their studies, for them to build a long term career with the Toray Group of Companies.
The identified groups/courses are as follow:
The timelines students should look out for in this yearly programs are as follows:
|Aug||* Announcement of TORAY Scholarship Program via University’s and TORAY’s website.|
|* Application open.|
|End Sep||* Application close.|
|* Compilation, screening and short-listing of applicants.|
|Mid Oct||* Interview and selection|
|End Oct||* Finalization and confirmation of respective recipients.|
|* Signing of Scholarship Agreement.|
|* First installment payment to new scholarship recipients.|
Duly completed and signed Forms (together with necessary documents) may be submitted to TORAY Group (Malaysia) in two ways:
Toray Scholarship Program for year 2016 is now open for registration.
Interested applicants are encourage to download the Application Form at the link below. All Forms must reach the TORAY Scholarship Secretariat not later than 28th September, 2016. Any late submissions will not be considered.
For more information and requirements on TORAY Scholarship Program, kindly refer to the guideline in the Application Form.
For further enquiries, please email us at firstname.lastname@example.org.
Yayasan KLK, a foundation established by KLK, offers scholarships to high-achieving young Malaysians who are studying or have gained a place at any Malaysian institutions of higher learning. Upon graduation, scholars may be offered the opportunity to work in KLK or its business units.
While undergoing tertiary education, scholars’ academic performance is monitored and they are expected to undergo practical training within the Group. Such monitoring is necessary as it ensures only the best talents are subsequently recruited to continue the Group’s tradition of leadership excellence.
For information and apply please visit here: http://www.klk.com.my/
BIASISWA PINJAMAN KERAJAAN NEGERI SARAWAK
PERMOHONAN BIASISWA PINJAMAN KERAJAAN NEGERI SARAWAK SESI 2016/2017
A. SYARAT PERMOHONAN
(I) MERUPAKAN WARGANEGARA MALAYSIA DAN PEMASTAUTIN TETAP DI SARAWAK.
(II) SEDANG MENGIKUTI PENGAJIAN BAGI KURSUS-
KURSUS DI PERINGKAT DIPLOMA DAN IJAZAH SARJANA MUDA
SECARA SEPENUH MASA DI INTITUSI PENGAJIAN TINGGI
(III) PEGAWAI-PEGAWAI PERKHIDMATAN AWAM/ BADAN
BERKANUN YANG BERCUTI BELAJAR DAN MENERIMA
SEPARUH GAJI ATAU BERGAJI PENUH ADALAH TIDAK
B. CARA PERMOHONAN
1. SEMUA PERMOHONAN HENDAKLAH DIKEMUKAKAN
SECARA DALAM TALIAN (ONLINE) MELALUI DI LAMAN
2. PERMOHONAN SECARA DALAM TALIAN YANG TELAH
DIISI HENDAKLAH LENGKAP DAN TEPAT SEPERTI YANG
TERCATAT DALAM DOKUMEN ASAL;
3. PERMOHONAN YANG TIDAK LENGKAP AKAN DITOLAK.
4. ANTARA BIDANG PENGAJIAN YANG DITAJA ADALAH KEJURUTERAAN, SAINS DAN SAINS GUNAAN, UNDANG-UNDANG, PENGURUSAN, EKONOMI DAN PERNIAGAAN, SAINS SOSIAL DAN TEKNOLOGI MAKLUMAT.
D. SEBARANG URUSAN PERTANYAAN SILA HUBUNGI
PEJABAT SURUHANJAYA PERKHIDMATAN AWAM
NEGERI SARAWAK DI TINGKAT 9 & 10, WISMA SATOK,
JALAN SATOK, 93400 KUCHING ATAU DI TALIAN 082-
236325 ATAU 082-236554.
E. TARIKH TUTUP
TARIKH TUTUP PERMOHONAN ADALAH 6 SEPTEMBER 2016
Sebarang maklumat lanjut, sila layari http://escholarship.sarawak.gov.my/
Please download form @ HERE
UEM Group Scholarship Programme is an annual initiative that supports the nation’s objectives of creating elite scholars and serves as a talent supply chain in developing future leaders for the country.
Scholarship For SPM leavers
Undergo a pre-university programme at Kolej Yayasan UEM (KYUEM) in Lembah Beringin, before furthering studies at a reputable university overseas locally, including foreign universities located in Malaysia.
Scholarship For STPM/Matriculation/Foundation leaver
Undergraduate studies at Universiti Teknologi Malaysia (UTM), Universiti Putra Malaysia (UPM), Universiti Kebangsaan Malaysia (UKM), Universiti Malaya (UM), Universiti Islam Antarabangsa Malaysia (UIAM), Universiti Sains Malaysia (USM), Universiti Utara Malaysia (UUM), Universiti Teknologi MARA (UiTM) – All Branches, University Teknologi Petronas (UTP), Universiti Tenaga Nasional (UNITEN) and Multimedia University (MMU). Others will not be considered.
In nurturing our scholars, leadership training and development activities with job attachments within the UEM Group of Companies are provided throughout the programme and within the bonded period.
For more info, please visit HERE
Yayasan TM invites qualified Malaysians student from Public Institution of Higher Education and Polytechnics to apply for scholarships to pursue studies:
TERMS AND CONDITIONS:
*This full-time scholarship application is opened to students not including TM Group employees.
For more info and apply, please visit HERE
Calon pelajar yang berjaya ditawarkan dan bersetuju untuk menerima penajaan bagi Program Ijazah Dalam Negara (PIDN) dan Program Dermasiswa B40 dikehendaki untuk membuka akaun Bank Islam.
Maklumat Akaun Bank Islam ini hendaklah dikunci masuk ke dalam Sistem e-penawaran dan Slip Pengesahan Akaun Bank Islam hendaklah dikemukakan semasa Sesi Pemurnian Dokumen Perjanjian bersama pihak JPA yang tarikhnya akan dimaklumkan kelak.
Kegagalan untuk mengemukakan slip pengesahan akaun bank semasa sesi tersebut akan menyebabkan kelewatan proses pembayaran elaun.
Sebarang pertanyaan lanjut, boleh hubungi talian 03-8885 3453/3541/3552
Sumber: esilav2 JPA